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Two-component Thermal Gel
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Two-component Thermal Gel

Thermal Conductivity:≥2.0W/m.K
Temperature:-40℃-200℃
Two-component, high thermal conductivity silicone gel
Medium viscosity, the surface is naturally sticky after curing
Meet EU ROHS, REACH directive requirements
Availability:
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Thermally conductive gel is a soft silicone resin-based material used for filling gaps, offering high thermal conductivity, low interfacial thermal resistance, and good thixotropy. It is ideal for applications with wide gap tolerances.


Thermally conductive gel primarily meets the requirements for low stress and high compressive modulus during product use, enabling automated production. It establishes good contact with electronic products during assembly, exhibiting low contact thermal resistance and excellent electrical insulation characteristics. Once cured, the thermal gel functions similarly to a thermal pad, offering robust resistance to high temperatures and aging, capable of long-term operation in temperatures ranging from -40°C to 200°C.

WechatIMG451

Features

◎Excellent insulation effect.

◎Good voltage resistance, high and low temperature resistance.

◎Excellent compressibility.

◎Fireproof rating UL94 V-0.

◎Replacing traditional assembled sheets with indeterminate shapes.

◎It can be applied in different environments and can provide various thicknesses.

◎Glue can be dispensed by various manual or automated processes.

◎The desired thickness can be maintained after curing.


Application method

◎Two-component thermal gel can be used in various ways,

◎Including: automatic dispensing, manual coating.


Application field

◎Power battery ◎Automotive electronics ◎Communication facilities ◎Electronic equipment and peripheral applications ◎Application between heat conduction heat source and radiator

00

Technical Parameters

Test items

technical indicators

Test Methods

color

A component: brown red

B component: White

White

Corrosive

conform to GB/T 12000-2003

conform toGB/T 12000-2003,time 96h

volatility

conform to GB/T 33372-2020

GB/T 33372-2020

Viscosity(Cps

A component: 25±50000

B component: 25±50000

GB/T 2794

Thermal Conductivity

(W/m.k)

≥2.0

ASTM D5470

Tensile Strength(Mpa)

0.01~0.015(25℃)

0.01~0.015(55℃)

ASTM D412(bondingA1-A1)

Shear strength(Mpa)

0.03~0.04(25℃)

0.01~0.015(55℃)

ASTM D412(bondingA1-A1)

Peel strength(Mpa)

0.01~0.015(25℃)

0.01~0.015(55℃)

ASTM D412(bondingA1-A1)

operating time(min)

≥60@25℃

Viscosity change≤Twice the initial viscosity

Full curing time(h)

≤24@25℃

curing curve

Density(g/cm3)

≦1.98

ASTM D792

Hardness(Shore 00)

60±5

ASTM D2240

Insulation resistance

(MΩ)

≥500

ASTM D257

withstand voltage(mA)

≤5,No breakdown, flashover phenomenon

1800V AC,+1min

breakdown voltage

(kv/mm)

≥8

ASTM D149

Volume resistivity

(Ω.cm)

≥10¹²

ASTM D257

Flammability rating

V0

UL-94

Silicone volatilization

(ppm)

≤150

D3~D10

seawater immersion

6~9,14~18meet the requirements

3.5%NaC1solution immersion 4h

Cured drawing sample size15*15*50

Glue area15*15*0.2

Cured Shear Sample Size100*25*1.5mm

Glue area 25*12.5*0.2




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