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Thermally Conductive Gel
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Thermally Conductive Gel

Thermally conductive gel is a material with high thermal conductivity, designed to solve thermal management problems in electronic devices and components. Its excellent thermal conductivity makes it widely used in electronic heat dissipation, LED lighting, semiconductor packaging and other fields, effectively reducing equipment temperature and improving performance and life.
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Thermally conductive gel is a material with high thermal conductivity, designed to solve thermal management problems in electronic devices and components. Its excellent thermal conductivity makes it widely used in electronic heat dissipation, LED lighting, semiconductor packaging and other fields, effectively reducing equipment temperature and improving performance and life.

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Product Features:

High thermal conductivity: thermally conductive gel has extremely high thermal conductivity, which can quickly transfer heat from the heat source to the heat sink or other heat dissipation equipment, ensuring that electronic components operate at the optimal operating temperature.


Excellent flexibility: The gel material is highly flexible and can easily fill and adapt to various irregular surfaces to ensure sufficient contact and heat conduction.


Low thermal resistance: With low thermal resistance, it can effectively reduce the obstruction of heat in the material and optimize the thermal management effect.


Good durability: The gel material is resistant to high temperature and chemical corrosion, and will not decline or deteriorate due to long-term use, ensuring long-term stable thermal conduction effect.


Easy to apply: thermally conductive gel can be applied to the parts that need heat dissipation by simple coating or extrusion. It is easy to operate and suitable for mass production and individual repairs.


Environmentally friendly and safe: The gel does not contain harmful substances and meets environmental standards. It can be used safely without worrying about pollution to the environment or equipment.


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Application areas:

Electronic equipment heat dissipation: Suitable for heat dissipation management of electronic components such as computer processors (CPUs), graphics processors (GPUs), and memory bars.


LED lighting: Effectively conducts heat in LED lamps and modules to improve light efficiency and extend service life.


Semiconductor packaging: Used for packaging and heat dissipation of semiconductor chips to optimize their working performance.


Electric vehicles: Provide efficient thermal management in electric vehicle batteries and motors to ensure system stability and safety.



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